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PCB Specifications
| Parameters | Capability | Notes |
|---|---|---|
| MULTI LAYERS | 1-2-4-6-8 | The number of copper layers in the board. |
| PCB MATERIAL | FR-4 | |
| AVAILABLE COLOR | Green, Red, Yellow, Blue, White, Black, Matte Black, Purple | |
| SILK SCREEN | White, Black (For White and Yellow Solder Mask) | |
| MAXIMUM SIZE | 55cm X 55cm |
Single board: 10mm*10mm~550mm*550mm. V-cut Panel board: 80mm*80mm~550mm*550mm Stamp holes/slots panel board: ≥80m*80mm |
| MINIMUM QTY | 5pcs | Only multiples of 5 can be selected for the quantity. If the production quantity is greater than 8000, please contact us for help |
| BOARD THICKNESS | 0.6mm,0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm | |
| THICKNESS TOLERANCE | (t≥1.0mm) ± 10% (t<1.0mm) ± 0.1mm |
|
| MINIMUM PCB TRACK | 6mil (Recommend >8mil) | |
| MINIMUM TRACK SPACE | 6mil (Recommend >8mil) | |
| MINIMUM PADS SPACE | 8mil | |
| MINIMUM SILKSCREEN TEXT WIDTH | 0.15mm |
The preferred ratio of width to height is 1:6. If outline font is designed and the solid part is filled with lines, then the filling line needs to be no less than 0.15mm too, and the hollow part needs to be more than 0.2mm. |
| MINIMUM SILKSCREEN TEXT HEIGHT | 0.8mm | |
| OUT LAYER COPPER THICKNESS | 1oz(35um)/2oz(70um) |
For 1 oz board, please make sure the trace width/space is larger than 5mil for 2 layer board, and 3.5mil for 4/6 layer board. For 2 oz board, please make sure the trace width/space of larger than 8mil for 2/4/6 layer board. |
| INNER LAYER COPPER THICKNESS | 17um/35um | The copper weight for inner layers is 0.5 oz by default. |
| SURFACE FINISH | HASL, HASL (Lead Free), ENIG, OSP | |
| DRILLING HOLE | 0.3mm | |
| DRILL DIAMETER TOLERANCE (NON-PLATED) | 0.05mm | |
| DRILL DIAMETER TOLERANCE (PLATED) | 0.1mm | |
| OUTLINE TOLERANCE (MECHANICAL) | ±0.20mm |
Premium PCB Specifications
| Parameters | Capability |
|---|---|
| MULTI LAYERS | 1-28 |
| PCB MATERIAL | FR-4 |
| AVAILABLE COLOR | green/red/yellow/blue/white/black/purple/matte black |
| SILK SCREEN | Could be specified |
| MAXIMUM SIZE | 55cm X 55cm |
| MINIMUM QTY | 5pcs |
| BOARD THICKNESS | 0.4mm-6.0mm |
| MINIMUM PCB TRACK | 3mil |
| MINIMUM TRACK SPACE | 3mil |
| MINIMUM DRILING HOLE | 0.2mm |
| MINIMUM BGA SIZE | 0.2mm |
| OUT LAYER COPPER THICKNESS | 0.5oz-12oz |
| SURFACE FINISH | HASL, HASL (Lead Free), ENIG, OSP |
| DRILLING HOLE | 0.3mm |
| BURIED/BLIND HOLE | Support |
| RESIGN PLUG HOLE | Support |
| SPECIFIED STACK-UP | Support |
Multilayer PCB
| Parameters | Capability |
|---|---|
| MULTI LAYERS | 1-22 |
| Finished BOARD THICKNESS | 0.2mm-6.0mm |
| FINISHED COPPER THICKNESS | 0.5oz-12oz |
| MIN TRACE WIDTH | 0.075mm |
| MIN BLIND VIA | 0.1mm |
| MIN V-GROOVE PCB THICKNESS | 0.6mm |
| MINIMUM BGA PAD/SPACE | 0.2mm/0.1mm |
| PLUG HOLE SIZE | 0.2-0.4mm |
| MATERIAL | FR4, Aluminum, Rogers, Polyimide |
| SURFACE FINISH | HASL, HASL (Lead Free), ENIG, OSP |
| WARP& TWIST | ≤0.75% |
| N/C ROUTING TOLERANCE | ±0.1mm |
Aluminum PCB(MC PCB, AL substrate)
| Parameters | Capability |
|---|---|
| MULTI LAYERS | 1-2-4 |
| Finished BOARD THICKNESS | 1.0mm-2.0mm |
| MIN TRACE/SPACING | ≥5mil |
| MIN HOLE | ≥0.5mm |
| SURFACE FINISH | HASL, ENIG, OSP |
| FINISHED COPPER | 1oz, 2oz |
| SOLDER MASK COLOR | Green, Blue, Yellow, Red, Black, White |
Flex/ Rigid-Flex/ Multilayer Flex PCB
| Parameters | Capability | |
|---|---|---|
| MULTI LAYERS | 1-6 | |
| MATERIAL | Polyimide, PEEK, FR4 | |
| Finished BOARD THICKNESS | 0.1mm-0.3mm | |
| FINISHED COPPER THICKNESS | 1/3oz, 1/2oz, 1oz | |
| Max BOARD DIMENSION | 250mmx250mm | |
| MIN BOARD DIMENSION | 5mmx10mm | |
| Min. HOLE DIAMETER | 0.2mm(CNC)(8mil) | |
| HOLE WALL COPPER THICKNESS | 10-35um | |
| HOLE SPACE TOLERANCE | ±0.075mm | |
| MIN HOLE TO HOLE SPACE | 0.50mm | |
| MIN TRACE WIDTH | 1/3oz | 2.0mil/2.0mil |
| AND SPACE | 1/2oz | 2.5mil/2.5mil |
| 1oz | 3.0mil/3.0mil | |
| 2oz | 4.0mil/4.0mil | |
| TRACE TOLERANCE | ±20% | |
| MIN ANNULAR RING | 0.2mm | |
| MIN CENTER DISTANCE IN CONTIGUOUS FINGER | 0.1mm | |
| SOLDER RESISTANCE CLEARANCE /COVERAGE | 0.15mm/0.1mm | |
| SOLDERING RESISTANCE THICKNESS | 10um | |
| SILKSCEEN TEXT HEIGHT | 0.8mm | |
| SILKSCEEN LINE WIDTH | 0.15mm | |
| BASED MATERIAL(PI) THICKNESS | 0.025mm-0.125mm | |
| SELECTIVE FINISH | ENIG | Ni: 1-6um |
| Gold: 0.03-0.1um | ||
| OSP | OSP file: 0.2-0.7um | |
| PROFILING | PUNCHING,ROUTING,V-CUT | Tolerance :+/-0.13mm |
| DESIGN SPACE | MIN HOLE TO HOLE | 0.50mm |
| MIN COPPER TO OUTLINE | 0.20mm | |
| MIN SILKSCREEN TO SOLDER MASK OPENING | 0.20mm | |
PCB Assembly
| Parameters | Capability |
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| PCB Types For Assembly |
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| Part Sourcing |
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| Assembly Options |
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| Solding Types |
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| Quality Control |
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| Order Processing Ability |
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| Part sourcing of the turn-key solution |
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| Value-added services |
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